Kākoʻo ʻia ʻo BOM Service TPS22965TDSGRQ1 nā ʻāpana uila ʻokoʻa Ic Chip.
Huahana Huahana
| ANO | HOIKE |
| Māhele | Nā Kaapuni Hoʻohui (IC) |
| ʻO Mfr | Nā mea kani ʻo Texas |
| moʻo | Kaʻa, AEC-Q100 |
| Pūʻolo | Lepe & Reel (TR) ʻOki lipine (CT) Digi-Reel® |
| Kūlana Huahana | ʻeleu |
| ʻAno hoʻololi | Manaʻo Nui |
| Ka helu o nā mea hoʻopuka | 1 |
| Pākuʻi - Hoʻokomo: Hoʻopuka | 1:1 |
| Hoʻonohonoho hoʻopuka | ʻaoʻao kiʻekiʻe |
| ʻAno Hoʻopuka | N-Kula |
| Ikepili | On/off |
| Voltage - Haawe | 2.5V ~ 5.5V |
| Voltage - Hoʻolako (Vcc/Vdd) | 0.8V ~ 5.5V |
| I kēia manawa - Hua'ōlelo (Max) | 4A |
| Rds On (Typ) | 16mOhm |
| ʻAno hoʻokomo | Hoʻohuli ʻole |
| Nā hiʻohiʻona | Hoʻokuʻu ʻia, Hoʻopaʻa ʻia ka Slew Rate |
| Palekana hewa | - |
| Ka Mahana Hana | -40°C ~ 105°C (TA) |
| ʻAno kau ʻana | Mauna ʻili |
| Pūʻolo Mea Mea Hoʻolako | 8-WSON (2x2) |
| Pūʻolo / hihia | 8-WFDFN Papa Hōʻike |
| Helu Huahana Kumu | TPS22965 |
He aha ka paʻi
Ma hope o ke kaʻina hana lōʻihi, mai ka hoʻolālā ʻana i ka hana ʻana, loaʻa iā ʻoe kahi chip IC.Eia naʻe, liʻiliʻi a lahilahi ka puʻupuʻu a hiki ke maʻalahi a ʻeha inā ʻaʻole mālama ʻia.Eia kekahi, ma muli o ka liʻiliʻi o ka chip, ʻaʻole maʻalahi ke kau ʻana ma ka papa me ka lima me ka ʻole o ka hale nui.
No laila, aia ka wehewehe ʻana o ka pūʻolo.
ʻElua ʻano o nā pūʻolo, ʻo ka pōʻai DIP, ka mea maʻamau i loaʻa i nā mea pāʻani uila a me ke ʻano he centipede i ka ʻeleʻele, a me ka puʻupuʻu BGA, ka mea maʻamau i loaʻa i ke kūʻai ʻana i ka CPU i loko o kahi pahu.ʻO nā ʻano hana hoʻopili ʻē aʻe ka PGA (Pin Grid Array; Pin Grid Array) i hoʻohana ʻia i nā CPU mua a i ʻole kahi mana hoʻololi o ka DIP, ka QFP (plastic square flat package).
No ka mea he nui nā ʻano hana hoʻopili like ʻole, e wehewehe ana kēia i ka DIP a me BGA pūʻolo.
ʻO nā pūʻolo kuʻuna i mau no nā makahiki
ʻO ka pūʻolo mua e hoʻokomo ʻia ʻo ka Dual Inline Package (DIP).E like me kāu e ʻike ai mai ke kiʻi ma lalo nei, ua like ka chip IC i loko o kēia pūʻolo me kahi centipede ʻeleʻele ma lalo o ka lālani pālua o nā pine, he mea kupanaha.Eia nō naʻe, no ka mea i hana ʻia me ka plastic, ʻilihune ka hopena wela a ʻaʻole hiki ke hoʻokō i nā koi o nā pahu kiʻekiʻe o kēia manawa.No kēia kumu, ʻo ka hapa nui o nā IC i hoʻohana ʻia i loko o kēia pūʻolo he mau chips lōʻihi loa, e like me ka OP741 ma ke kiʻi ma lalo nei, a i ʻole nā IC ʻaʻole koi i ka wikiwiki a loaʻa nā chips liʻiliʻi me nā vias liʻiliʻi.
ʻO ka puʻupuʻu IC ma ka hema ka OP741, kahi mea hoʻonui uila maʻamau.
ʻO ka IC ma ka hema ʻo OP741, kahi mea hoʻonui uila maʻamau.
No ka pūʻolo Ball Grid Array (BGA), ʻoi aku ka liʻiliʻi ma mua o ka pūʻolo DIP a hiki ke maʻalahi i nā mea liʻiliʻi.Eia kekahi, no ka mea aia nā pine ma lalo o ka chip, hiki ke hoʻokomo ʻia nā pine metala ke hoʻohālikelike ʻia me DIP.He mea kūpono kēia no nā chips e koi ana i ka nui o nā pilina.Eia naʻe, ʻoi aku ka nui o ke kumukūʻai a ʻoi aku ka paʻakikī o ke ala pili, no laila hoʻohana nui ʻia i nā huahana kiʻekiʻe.
