JXSQ Nā ʻāpana IC hou a kumu mua REG BUCK ADJ 3.5A 8SOPWR LMR14030SDDAR mea uila
Huahana Huahana
ANO | HOIKE |
Māhele | Nā Kaapuni Hoʻohui (IC) |
ʻO Mfr | Nā mea kani ʻo Texas |
moʻo | SWITCHER MAʻalahi® |
Pūʻolo | Lepe & Reel (TR) ʻOki lipine (CT) Digi-Reel® |
SPQ | 2500T&R |
Kūlana Huahana | ʻeleu |
Hana | Haʻahaʻa-Iho |
Hoʻonohonoho hoʻopuka | maikaʻi |
Topology | Buck |
ʻAno Hoʻopuka | Hiki ke hoʻololi |
Ka helu o nā mea hoʻopuka | 1 |
Voltage - Hookomo (Min) | 4V |
Voltage - Hookomo (Max) | 40V |
Voltage - Hoʻopuka (Min/Paʻa) | 0.8V |
Voltage - Puke (Max) | 28V |
ʻO kēia manawa - Huakaʻi | 3.5A |
Ka pinepine - Ke hoʻololi | 200kHz ~ 2.5MHz |
Hoʻoponopono hoʻoponopono | No |
Ka Mahana Hana | -40°C ~ 125°C (TJ) |
ʻAno kau ʻana | Mauna ʻili |
Pūʻolo / hihia | 8-PowerSOIC (0.154", 3.90mm Laulā) |
Pūʻolo Mea Mea Hoʻolako | 8-SO PowerPad |
Helu Huahana Kumu | LMR14030 |
1.He ʻokoʻa ke ʻano, kumu a me ka hoʻohana ʻana i nā wafers epitaxial a me nā chips.
I. Ke ano okoa
1, epitaxial wafer: epitaxial wafer pili i kahi kiʻiʻoniʻoni aniani kikoʻī i ulu ʻia ma kahi substrate substrate i hoʻomehana ʻia i ka mahana kūpono.
2, puʻupuʻu: ʻo chip kahi mea semiconductor state solid.Hoʻopili ʻia ka chip holoʻokoʻa i ka resin epoxy.
ʻO ka lua, ʻokoʻa ke kumu
1, epitaxial wafer: ʻo ke kumu o ka wafer epitaxial e hoʻohui i nā electrodes i ka epitaxial e hoʻomaʻamaʻa i ka sila a me ka hoʻopili ʻana o ka huahana.
2, chip: ʻo ke kumu o ka chip e hoʻohuli i ka ikehu uila i ka ikehu māmā no ke kukui.
ʻEkolu, hoʻohana like ʻole
1, epitaxial wafers: epitaxial wafers e pono ai no ke kaʻina waena a me ke kaʻina hana hope o ka chip LED, me ka ʻole, ʻaʻole hiki ke hana i kahi semiconductor ʻālohilohi kiʻekiʻe.
2, chip: ʻo chip ka mea nui no ka hana ʻana i nā kukui LED, ka pale LED, ke kukui LED.
2.He aha ke kīpē?
ʻO kahi chip he microelectronic integrated circuit nui, hiki ke kapa ʻia he IC;ʻo ia hoʻi, he mana kaapuni paʻi i liʻiliʻi ʻia i ka pae nano (miliona o ka millimeter).ʻO ka ʻaoʻao mua o ka papa kaapuni maʻamau i paʻi ʻia he helu nui o nā ʻāpana radio like ʻole, me nā triodes, diodes, capacitors, electrolytic, resistors, mid-cycle regulators, switches, power amplifiers, detectors, filters, etc. ʻO nā ʻōpuni paʻi a me nā hui solder i paʻi ʻia ma ka papa fiber carbon.ʻO ia ka huahana nui o ka ʻenehana microelectronics a loaʻa kahi ākea o nā noi.Hoʻokomo ʻia nā chips i kā mākou kamepiula maʻamau, kelepona paʻa, nā huahana uila, nā mea uila, etc.;ʻōlelo pinepine ka poʻe i nā kaapuni i hoʻohui ʻia e like me nā chips.
3.ʻO ke ʻano mea i loko o kahi puʻupuʻu
ʻO ka chip he huaʻōlelo maʻamau no ka huahana semiconductor component, i hana ʻia me nā mea semiconductor (ka hapa nui o ke silicon), a aia nā capacitors, resistors, diodes, a me nā transistors.ʻO ka semiconductor kahi mea ma waena o kahi mea hoʻokele, e like me ke keleawe, kahi e hiki ai ke hele maʻalahi i ka uila, a me kahi insulator, e like me ka rubber, ʻaʻole ia e hoʻokele i ka uila.