ʻO Tibco News, Iune 30, ua hoʻopuka ke aupuni Holani i nā kānāwai hou loa e pili ana i ka hoʻokuʻu ʻana i nā lako semiconductor, ua wehewehe kekahi mau media i kēia me ka piʻi hou ʻana o ka mana o photolithography e kūʻē iā Kina i nā DUV āpau.ʻO ka ʻoiaʻiʻo, ʻo kēia mau hoʻoponopono hoʻokele hoʻokuʻu hou e kuhikuhi ana i ka 45nm kiʻekiʻe a ma lalo o nā ʻenehana hana chip, e komo pū ana me nā mea hana hoʻoheheʻe atomika ALD hou loa, nā mea ulu epitaxial, nā lako plasma deposition a me nā ʻōnaehana lithography immersion, a me ka ʻenehana, lako polokalamu i hoʻohana ʻia. e hoʻohana a hoʻomohala i ia mau mea hana holomua.
Ma kahi ʻōlelo iā Tibco, ua hoʻokūpaʻa ʻo ASML e uhi wale nā kānāwai hoʻokele hou o ke aupuni Dutch i kekahi o nā hiʻohiʻona DUV hou loa, me ka TWINSCAN NXT:2000i a me nā ʻōnaehana lithography immersion ma hope.Ua kaupalena ʻia ka lithography EUV ma mua, a ʻaʻole mālama ʻia ka hoʻouna ʻana o nā ʻōnaehana ʻē aʻe e ke aupuni Dutch.Wahi a ka ʻike punaewele ASML, ʻōnaehana lithography DUV immersion, me: TWINSCAN NXT: 2050i, NXT: 2050i, NXT: 1980Di ʻekolu mīkini lithography, hiki iā lākou ke hana i ka hana wafer 38nm ~ 45nm.
Eia kekahi, ʻo nā mīkini lithography DUV maloʻo hiki ke hana i ka wafer ma luna o 45nm, e like me 65nm ~ 220nm kaʻina, e like me TWINSCAN XT:400L, XT:1460K, NXT:870, etc., ʻaʻole i hoʻokomo ʻia i ka papa inoa hoʻopaʻi Dutch.
ʻO ka papa inoa hoʻomalu Dutch, i unuhiʻia e Tibco, penei:
ʻO Regulation MinBuza.2023.15246-27 i hoʻopuka ʻia e ke Kuhina o ka Foreign Trade and Development Cooperation o Netherlands e hāʻawi i nā koi laikini no ka lawe ʻana aku i nā lako hana kiʻekiʻe no nā semiconductor i ʻōlelo ʻole ʻia ma ka Annex I o ka Regulation No. 2021/821 (e pili ana i ka semiconductor holomua. mea hana hana)
Paukū 2: Ua pāpā kēia kānāwai i ka lawe ʻana aku i nā lako hana semiconductor holomua mai Netherlands mai me ka ʻae ʻole o ke Kuhina.
Paukū 3:
1. Na ka mea hoʻopuka aku e hana i ka palapala ʻae i ʻōlelo ʻia ma ka Paukū 2 a waiho ʻia i ka loio.
2. Ma kekahi hihia, e komo ka palapala noi:
a）ka inoa a me ka helu wahi o ka mea lawe aku;
b）Ka inoa a me ka helu wahi o ka mea i loaʻa a me ka mea hoʻohana hope o nā lako hana semiconductor holomua;
c）Ka inoa a me ka helu wahi o ka mea i loaʻa a me ka mea hoʻohana hope o nā lako hana semiconductor holomua.
3, i kekahi hihia, he kuleana ko ka mea hoʻopiʻi e noi i ka mea hoʻopuka e hāʻawi i ka ʻaelike ma ka lawe ʻana aku, a me kahi ʻōlelo ma ka hoʻohana hope.
Paukū 4:
ʻO ka laikini i ho'ākākaʻia ma ka Paukū 2, hiki ke kau i nā kūlana a me nā mea.
ʻO ka hāʻawi ʻana i ka laikini i wehewehe ʻia ma ka Paukū 2 hiki ke loaʻa me nā hōʻailona.
Paukū V:
Hiki ke hoʻopau ʻia nā laikini i ʻōlelo ʻia ma ka Paukū II ma kēia mau hihia:
a) Ua hoʻopuka ʻia ka laikini ma muli o ka ʻike hewa a i ʻole ka ʻike piha ʻole;
b) ʻAʻole i mālama ʻia nā ʻōlelo, nā kūlana a me nā kapu o ka laikini;
c) No nā kumu o ke kulekele aupuni a me ka palekana.
Ka manawa hoʻouna: Jul-02-2023