E mālama ʻia ka 3rd Generation Semiconductor Forum 2022 ma Suzhou ma Dekemaba 28th!
Nā Mea Hana Semiconductor CMPa me Targets Symposium 2022 e mālama ʻia ma Suzhou ma Dekemaba 29th!
Wahi a ko McLaren paena pūnaewele, ua hoʻohui hou lākou i ka mea kūʻai aku OEM, ka American hybrid sports car brand Czinger, a e hāʻawi i ka hanauna hou IPG5 800V silicon carbide inverter no ka mea kūʻai aku 21C supercar, i manaʻo ʻia e hoʻomaka i ka lawe ʻana i ka makahiki aʻe.
Wahi a ka hōʻike, e hoʻolako ʻia ka Czinger hybrid haʻuki kaʻa 21C me ʻekolu IPG5 inverters, a ʻo ka hopena kiʻekiʻe e hiki i ka 1250 horsepower (932 kW).
ʻO ke kaumaha ma lalo o 1,500 kilokani, e hoʻolako ʻia ke kaʻa haʻuki me kahi ʻenekini V8 māhoe twin-turbocharged 2.9-lita e huli ana ma luna o 11,000 rpm a wikiwiki mai 0 a 250 mph i 27 kekona, me ka hoʻohui ʻana i ke kaʻa uila silicon carbide.
Ma Kekemapa 7, ua hoʻolaha ka pūnaewele mana o Dana ua kau inoa lākou i kahi ʻaelike hoʻolako lōʻihi me SEMIKRON Danfoss e hoʻopaʻa i ka mana hana o nā semiconductors carbide silicon.
Ua hōʻike ʻia e hoʻohana ʻo Dana i kā SEMIKRON's eMPack silicon carbide module a ua hoʻomohala i nā mea hoʻohuli uila a me ke kiʻekiʻe.
Ma ka lā 18 o Pepeluali i kēia makahiki, ua ʻōlelo ka pūnaewele mana o SEMIKRON ua kau inoa lākou i kahi ʻaelike me kahi mea hana kaʻa Kelemania no kahi 10+ billion euros (ʻoi aku ma mua o 10 billion yuan) silicon carbide inverter.
Ua hoʻokumu ʻia ʻo SEMIKRON ma 1951 ma ke ʻano he mea hana Kelemania i nā modula mana a me nā ʻōnaehana.Ua hōʻike ʻia i kēia manawa ua kauoha ka hui kaʻa Kelemania i ka mana hou o SEMIKRON eMPack®.ʻO ka eMPack® power module platform ua hoʻopaʻa ʻia no ka ʻenehana carbide silicon a hoʻohana i ka ʻenehana "direct pressure mold" (DPD) i hoʻopaʻa ʻia, me ka hoʻokumu ʻana o ka volume i hoʻomaka ʻia i 2025.
Hoʻohui ʻia ʻo Danahe mea kūʻai aku ʻo Tier1 ʻAmelika i hoʻokumu ʻia ma 1904 a i hoʻokumu ʻia ma Maumee, Ohio, me ke kūʻai aku o $8.9 biliona ma 2021.
Ma Dekemaba 9, 2019, ua hōʻike ʻo Dana i kāna SiC inverterTM4, hiki ke hāʻawi aku ma mua o 800 volts no nā kaʻa kaʻa a me 900 volts no nā kaʻa heihei.Eia kekahi, loaʻa i ka inverter ka mana o 195 kilowatts no ka lita, aneane pālua i ka pahuhopu 2025 US Department of Energy.
E pili ana i ke kau inoa ʻana, ua ʻōlelo ʻo Dana CTO Christophe Dominiak: Ke ulu nei kā mākou papahana electrification, loaʻa iā mākou kahi backlog kauoha nui ($350 miliona ma 2021), a he mea koʻikoʻi nā mea hoʻohuli.Hāʻawi kēia ʻaelike hoʻolako makahiki me Semichondanfoss iā mākou i kahi pono hoʻolālā ma o ka hōʻoia ʻana i ke komo ʻana i nā semiconductors SIC.
Ma ke ʻano he kumu nui o nā ʻoihana hoʻolālā e kū mai ana e like me nā kamaʻilio o ka hanauna e hiki mai ana, nā kaʻa ikehu hou, a me nā kaʻaahi kiʻekiʻe, ʻo ke kolu o ka hanauna semiconductor i hōʻike ʻia e ka silicon carbide a me ka gallium nitride ua helu ʻia ma ke ʻano he kumu nui i ka "14th Five-Year Plan. ” a me ka papa kuhikuhi o nā pahuhopu lōʻihi no 2035.
ʻO Silicon carbide 6-inch wafer production capacity aia i loko o ka manawa o ka hoʻonui wikiwiki ʻana, ʻoiai nā mea hana alakaʻi i hōʻike ʻia e Wolfspeed a me STMicroelectronics ua hiki i ka hana ʻana i nā wafers silicon carbide 8-inch.ʻO nā mea hana hale e like me Sanan, Shandong Tianyue, Tianke Heda a me nā mea hana ʻē aʻe e kālele nui ana i nā wafers 6-inch, me ka ʻoi aku o 20 mau papahana pili a me kahi hoʻopukapuka ʻoi aku ma mua o 30 billion yuan;ʻO nā ʻenehana wafer 8-inihi o ka ʻāina ke hopu pū nei.Mahalo i ka hoʻomohala ʻana o nā kaʻa uila a me ka hoʻopiʻi ʻana i nā ʻōnaehana, manaʻo ʻia ka piʻi ʻana o ka mākeke o nā mea silicon carbide e hiki i 30% ma waena o 2022 a me 2025. E hoʻomau ʻia nā substrate i ke kumu palena palena nui no nā mīkini carbide silicon i nā makahiki e hiki mai ana.
Ke alakaʻi nui ʻia nei nā mea GaN e ka mākeke mana wikiwiki a me ka 5G macro base station a me ka millimeter wave small cell RF market.ʻO ka mākeke GaN RF ka mea nui i noho ʻia e Macom, Intel, a me nā mea ʻē aʻe, a ʻo ka mākeke mana me Infineon, Transphorm a pēlā aku.I nā makahiki i hala iho nei, ʻo nā ʻoihana kūloko e like me Sanan, Innosec, Haiwei Huaxin, a me nā mea ʻē aʻe ke hoʻohana ikaika nei i nā papahana gallium nitride.Eia kekahi, ua ulu wikiwiki nā mea laser gallium nitride.Hoʻohana ʻia nā laser semiconductor GaN i ka lithography, ka mālama ʻana, ka pūʻali koa, ka lāʻau lapaʻau a me nā kula ʻē aʻe, me nā moku makahiki o kahi o 300 miliona mau ʻāpana a me nā helu ulu hou o 20%, a ua manaʻo ʻia ka huina o ka mākeke e hōʻea i $ 1.5 biliona ma 2026.
E mālama ʻia ka 3rd Generation Semiconductor Forum ma Dekemaba 28, 2022. He nui o nā ʻoihana alakaʻi ma ka home a me nā ʻāina ʻē i komo i ka ʻaha kūkā, e kālele ana i nā kaulahao ʻoihana i luna a me lalo o ka silicon carbide a me ka gallium nitride;ʻO ka substrate hou loa, epitaxy, ʻenehana hana ʻenehana a me ka ʻenehana hana;ʻO ka holomua noiʻi o nā ʻenehana ʻokiʻoki o nā semiconductors bandgap ākea e like me ka gallium oxide, aluminum nitride, daimana, a me ka zinc oxide.
Ke kumuhana o ka halawai
1. ʻO ka hopena o ka pāpā ʻana i ka chip US i ka hoʻomohala ʻana o nā semiconductors ʻekolu o Kina
2. ʻO ka mākeke semiconductor o ka honua a me Kina a me ke kūlana hoʻomohala ʻoihana
3. Hāʻawi a me ka koi ʻana o ka Wafer a me nā manawa kūʻai semiconductor ʻekolu o ka hanauna
4. Ka nānā 'ana o ka ho'opukapuka a me ka mākeke no nā papahana SiC 6 iniha
5. Kūlana kūlana a me ka hoʻomohala ʻana o ka ʻenehana ulu SiC PVT a me ke ʻano hana wai
6. 8-inch SiC localization kaʻina a me ka ʻenehana holomua
7. Makeke SiC a me nā pilikia hoʻomohala ʻenehana
8. Ka hoʻohana ʻana i nā polokalamu GaN RF a me nā modula ma nā kahua kahua 5G
9. Hoʻomohala a hoʻololi i ka GaN i ka mākeke wikiwiki
10. ʻenehana mīkini laser GaN a me ka noi mākeke
11. Nā manawa kūpono a me nā pilikia no ka localization a me ka ʻenehana a me ka hoʻomohala ʻana i nā lako
12. Nā manaʻolana hoʻomohala semiconductor ʻē aʻe ʻekolu
ʻO ka hoʻomaʻemaʻe mechanical(CMP) kahi kaʻina hana nui no ka hoʻokō ʻana i ka wafer flattening honua.Ke holo nei ke kaʻina hana CMP ma o ka hana ʻana i ka wafer silika, ka hana kaapuni i hoʻohui ʻia, ka hoʻopili ʻana a me ka hoʻāʻo ʻana.ʻO ka wai polishing a me ka polishing pad nā mea hoʻohana nui o ke kaʻina CMP, ʻoi aku ma mua o 80% o ka mākeke waiwai CMP.Ua loaʻa i nā ʻoihana waiwai a me nā lako CMP i hōʻike ʻia e Dinglong Co., Ltd. a me Huahai Qingke mai ka ʻoihana.
ʻO ka mea i manaʻo ʻia ke kumu kumu no ka hoʻomākaukau ʻana i nā kiʻiʻoniʻoni hana, i hoʻohana nui ʻia i nā semiconductors, panels, photovoltaics a me nā māla ʻē aʻe e hoʻokō ai i nā hana conductive a i ʻole blocking.Ma waena o nā mea semiconductor nui, ʻo ka mea i manaʻo ʻia ka mea i hana ʻia ma ka home.ʻO ka alumini home, ke keleawe, ka molybdenum a me nā mea ʻē aʻe i hoʻopaʻa ʻia i hana i nā holomua, ʻo nā hui nui i helu ʻia ʻo Jiangfeng Electronics, Youyan New Materials, Ashitron, Longhua Technology a pēlā aku.
ʻO nā makahiki ʻekolu e hiki mai ana he manawa o ka hoʻomohala wikiwiki ʻana o ka ʻoihana hana semiconductor China, SMIC, Huahong Hongli, Changjiang Storage, Changxin Storage, Silan Micro a me nā ʻoihana ʻē aʻe e hoʻolōʻihi i ka hoʻonui ʻana i ka hana, Gekewei, Dingtai Craftsman, China Resources Micro a me nā mea ʻē aʻe. E hoʻokomo pū ʻia ka hoʻolālā ʻoihana o nā laina hana wafer 12-inch i ka hana, e lawe mai i ka koi nui no nā mea CMP a me nā mea i manaʻo ʻia.
Ma lalo o ke kūlana hou, ʻoi aku ka nui o ka palekana o ke kaulahao lako fab home, a he mea nui ia e hoʻoulu i nā mea hoʻolako kūloko kūloko, kahi e lawe mai ai i nā manawa nui i nā mea hoʻolako home.ʻO ka ʻike kūleʻa o nā mea i hoʻopaʻa ʻia e hāʻawi pū i ka kuhikuhi no ka hoʻomohala ʻana i ka localization o nā mea ʻē aʻe.
E mālama ʻia ka Semiconductor CMP Materials and Targets Symposium 2022 ma Suzhou i ka lā 29 Dekemaba.
Ke kumuhana o ka halawai
1. Nā kumuhana CMP o Kina a me nā kulekele waiwai a me nā ʻano makeke
2. Ka hopena o ka hoʻopaʻi ʻana o ʻAmelika i ke kaulahao lako semiconductor home
3. Ka waiwai CMP a me ka mākeke pahuhopu a me ka loiloi ʻoihana koʻikoʻi
4. Semiconductor CMP polihing slurry
5. CMP polishing pad me ka wai hoʻomaʻemaʻe
6. Ka holomua o ka CMP polishing lako
7. Semiconductor target market lako a me ka koi
8. Nā ʻano o nā ʻoihana ʻoihana semiconductor kiʻekiʻe
9. Holomua i ka CMP a me ka 'ike loea
10. Ka ʻike a me ka kuhikuhi ʻana o ka localization o nā mea i hoʻopaʻa ʻia
Ka manawa hoʻouna: Jan-03-2023