Kaapuni i hoohuihuiia XCZU4EV-2SFVC784I IC SOC CORTEX-A53 784FCBGA o na mea Electronic Component IC Chip.
Huahana Huahana
| ANO | HOIKE |
| Māhele | Nā Kaapuni Hoʻohui (IC)Hoʻokomo ʻia |
| ʻO Mfr | AMD Xilinx |
| moʻo | Zynq® UltraScale+™ MPSoC EV |
| Pūʻolo | pā |
| Pūʻolo maʻamau | 1 |
| Kūlana Huahana | ʻeleu |
| Hoʻolālā | MCU, FPGA |
| Mea Hana Koko | Quad ARM® Cortex®-A53 MPCore™ me CoreSight™, Dual ARM®Cortex™-R5 me CoreSight™, ARM Mali™-400 MP2 |
| Nui uila | - |
| Nui RAM | 256KB |
| Pilipili | DMA, WDT |
| Hoʻohui | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Ka māmā holo | 533MHz, 600MHz, 1.3GHz |
| Nā ʻano kumu mua | Zynq®UltraScale+™ FPGA, 192K+ Pūnaehana Loko |
| Ka Mahana Hana | -40°C ~ 100°C (TJ) |
| Pūʻolo / hihia | 784-BFBGA, FCBGA |
| Pūʻolo Mea Mea Hoʻolako | 784-FCBGA (23×23) |
| Ka helu o I/O | 252 |
| Helu Huahana Kumu | XCZU4 |
ʻO nā palena mana a me nā pani hana!Hoʻopuka nā ST Microelectronics, Xilinx, a me nā hui ʻē aʻe i nā leka hoʻonui kumukūʻai
Mai ka hoʻomaka ʻana o Kepakemapa 2021, ua hoʻomaka ʻo Jiangsu Province e hoʻokō i "ka mana pālua o ka hoʻohana ʻana i ka ikehu", a ukali ʻia e Guangdong Province e hahai i nā palena mana a hoʻolaha koke i Yunnan, Guangxi, Zhejiang, a me nā wahi ʻē aʻe.Ua ukali ʻia e nā lono e pili ana ka hana ʻana o nā mea hana e like me Tesla, Sunrise, a me Global Wafer i nā pae like ʻole.
He mea pono e hoʻomaopopo i kēia manawa, ua hoʻolaha ʻo STMicroelectronics, Xilinx, a me nā mea hana ʻē aʻe i ka piʻi ʻana o ke kumukūʻai a hiki i 30%.
He aha ka hopena o ka ʻoki mana?
I kēia mau lā, ua hōʻike ka Pūnaewele i kahi leka mai ka mea kanu Sunbeam Kunshan i hoʻopuka ʻia e ka pani ʻana o ka mana.
Wahi a ka leka hoʻomaopopo, e kaupalena ʻia ka mea kanu Sunbeam Kunshan mai 8 pm ma 26 Kepakemapa a 24 pm ma 30 Kepakemapa 2021. I kēia manawa, ma hope o ke kūkākūkā ʻana me nā luna aupuni, ua hoʻopaʻa ʻia kahi lā e hoʻopau ai i ka hana ʻana o nā huahana e hana ʻia nei. hana ʻia ma ka mīkini.
Wahi a ka nūhou, ua ʻōlelo ʻo Rayson Group e like me ke kulekele palena o ke aupuni kūloko, ua hoʻonohonoho ʻia nā hoʻouna mua a e kaupalena ʻia ka hopena i nā mea kūʻai aku a me ka mea kanu ʻo Rayson's Kunshan.
ʻO Global Wafer, aia ma Kunshan, ua hoʻohaʻahaʻa iho i kāna huahana no ka manawa like me ke kulekele hoʻopaʻa mana o Suzhou, a ua manaʻo ʻia e pani ʻia ka hale kanu Kunshan a hiki i Kepakemapa 30. E hui pū ka hui me nā mea kanu ʻē aʻe o ka Pūʻulu hāʻawi i ke kākoʻo e kōkua i ka hana a me ka lawe ʻana i nā mea.
Eia kekahi, ua hoʻoponopono kekahi mau mea hana ma Suzhou, e like me KYEC, Kunshan Nandina, Xinxing, AUO, a me Kunshan Guangxing Electronics, i kā lākou hana i nā pae like ʻole ma muli o ke kulekele palena mana, ʻaʻole i ʻike ʻia he hopena koʻikoʻi no ka manawa.
Ma ka lā 27 o Kepakemapa, ua hoʻopuka ʻo ST STMicroelectronics i kāna hoʻolaha hoʻonui ʻekolu o ka makahiki.Ua ʻōlelo ka hui ʻo ka hemahema o kēia manawa i ke kaulahao semiconductor e hoʻomau nei i ka hopena koʻikoʻi i ka ʻoihana, me ka ʻole o nā hōʻailona o ka hoʻihoʻi pōkole.Me ka nui o ka loaʻa ʻana o kekahi mau lako kī i ke kaulahao hoʻolako, i hui pū ʻia me ka hoʻopukapuka ikaika o ka ʻoihana i ka hana ʻana, e hoʻonui ʻo ST i nā kumukūʻai ma nā huahana a pau, me ka waihona i loaʻa, i ka hapaha hope (Q4) o 2021.
He liʻiliʻi a he pipiʻi ka nui o ka MCU o ST ma ka mākeke.Ma hope o ka piʻi ʻana o ke kumukūʻai, ʻoi aku ka nui o ka liʻiliʻi o nā huahana chip.
No Xilinx, ua hoʻonui ka hui i nā kumukūʻai no nā kauoha a pau o kēia manawa a me ka wā e hiki mai ana, nā makana āpau, a me nā hoʻouna ʻana a pau a ma hope o Nowemapa 1, 2021. ʻO nā huahana i hoʻopili ʻia e ka piʻi ʻana he piʻi 10 pakeneka no nā ʻohana VersalM a pau;a he 20 pakeneka hoʻonui no nā huahana ʻē aʻe a pau.
I Kepakemapa, ua hoʻopuka ʻo ON Semiconductor i ka lua o nā leka hoʻonui kumukūʻai e hōʻike ana i ka piʻi ʻana o ke kumukūʻai no kekahi mau huahana, e hoʻokō ʻia i ka hoʻomaka ʻana o ʻOkakopa, a pili nā kumukūʻai hou i nā kauoha hou a me nā kauoha backlog e kū nei.
Mai kēia makahiki, ua hoʻolōʻihi ka mana hoʻokele mana o ON Semiconductor, IGBT, Mosfet a me nā huahana ʻē aʻe i nā manawa hoʻopuka ma ka papa, ʻoiai nā diodes, transistors, optocouplers, CMOS sensors, a me nā huahana ʻē aʻe i loaʻa kekahi degere o ka hemahema, me nā manawa hoʻopuka no ka ʻO kekahi o kāna mau huahana ua hiki i ka 52 pule.
ʻO ka piʻi ʻana o ke kumukūʻai hou loa e MediaTek, ka mea e hoʻolālā e hoʻonui i nā kumukūʻai o kekahi o kāna mau hāmeʻa chip mai Nowemapa 1, ʻoi aku hoʻi no nā hāmeʻa Wi-Fi me ka moʻo MT7668 a me MT7663, a hiki i 30%.
Eia kekahi, nui nā mea hana ʻē aʻe i hoʻololi i nā kumukūʻai o nā degere like ʻole.
Molex: Hoʻonui ʻia ma mua o 7 pakeneka ma ʻOkakopa 1.
Renesas: 15% hoʻonui i ka 1 ʻOkakopa.
Broadcom: 20% hoʻonui mai ʻOkakopa.
XANGSHUO: 20% hoʻonui no ka laina huahana holoʻokoʻa mai Ianuali o ka makahiki aʻe.
Xinghua: hoʻonui hou i ka hapahā 4.
Unitech: hoʻonui i nā kumukūʻai SoC ma kahi o 10-20%.
ʻO Chang Hwa Electric Material: kahi piʻi o 8% -25%.
ʻO Yushun Technology: e hoʻonui ʻia ka laina piha o nā huahana mai Kepakemapa 22
