Semiconductors Electronic Components TPS7A5201QRGRRQ1 Ic Chips BOM lawelawe Hoʻokahi wahi kūʻai
Huahana Huahana
ANO | HOIKE |
Māhele | Nā Kaapuni Hoʻohui (IC) |
ʻO Mfr | Nā mea kani ʻo Texas |
moʻo | Kaʻa, AEC-Q100 |
Pūʻolo | Lepe & Reel (TR) ʻOki lipine (CT) Digi-Reel® |
SPQ | 3000T&R |
Kūlana Huahana | ʻeleu |
Hoʻonohonoho hoʻopuka | maikaʻi |
ʻAno Hoʻopuka | Hiki ke hoʻololi |
Ka helu o na Luna Hooponopono | 1 |
Voltage - Hookomo (Max) | 6.5V |
Voltage - Hoʻopuka (Min/Paʻa) | 0.8V |
Voltage - Puke (Max) | 5.2V |
Haʻalele ka Voltage (Max) | 0.3V @ 2A |
ʻO kēia manawa - Huakaʻi | 2A |
PSRR | 42dB ~ 25dB (10kHz ~ 500kHz) |
Nā hiʻohiʻona hoʻomalu | Hiki |
Nā hiʻohiʻona pale | Ma luna o ka Mahana, Reverse Polarity |
Ka Mahana Hana | -40°C ~ 150°C (TJ) |
ʻAno kau ʻana | Mauna ʻili |
Pūʻolo / hihia | 20-VFQFN Papa Hōʻike |
Pūʻolo Mea Mea Hoʻolako | 20-VQFN (3.5x3.5) |
Helu Huahana Kumu | TPS7A5201 |
Ka nānā 'ana o nā chips
(i) He aha ka chip
ʻO ke kaapuni i hoʻohui ʻia, i hoʻopau ʻia ʻo IC;a i ʻole microcircuit, microchip, ʻo ka chip he ala o ka miniaturizing circuits (ʻo ka hapa nui o nā mea semiconductor, akā ʻo nā ʻāpana passive, a me nā mea ʻē aʻe) i ka uila, a hana pinepine ʻia ma ka ʻili o nā wafers semiconductor.
(ii) Kaʻina hana chip
ʻO ke kaʻina hana chip piha piha i ka hoʻolālā chip, ka hana wafer, ka hana pūʻolo, a me ka hoʻāʻo ʻana, ma waena o ia ka paʻakikī o ka hana wafer.
ʻO ka mea mua ka hoʻolālā chip, e like me nā koi hoʻolālā, ʻo ka "hoʻohālike" i hana ʻia, ʻo ka mea maka o ka chip ka wafer.
Hana ʻia ka wafer me ke silika, i hoʻomaʻemaʻe ʻia mai ke one quartz.ʻO ka wafer ka mea silicon i hoʻomaʻemaʻe ʻia (99.999%), a laila ua hana ʻia ke silikona maʻemaʻe i mau koʻokoʻo silicon, a lilo ia i mea hana no ka hana ʻana i nā quartz semiconductor no nā kaapuni i hoʻohui ʻia, i ʻoki ʻia i loko o nā wafers no ka hana chip.ʻO ka lahilahi o ka wafer,ʻo ka haʻahaʻa o ke kumukūʻai o ka hanaʻana, akāʻo kaʻoi aku o ka koiʻana i ke kaʻina hana.
Ka uhi ʻana o ka wafer
ʻO ka wafer coating ke kū'ē i ka oxidation a me ka pale wela a heʻano photoresist.
ʻO ka hoʻomohala ʻana i ka photolithography wafer a me ka etching
Hōʻike ʻia ke kahe kumu o ke kaʻina hana photolithography ma ke kiʻikuhi ma lalo nei.ʻO ka mea mua, hoʻopili ʻia kahi papa photoresist i ka ʻili o ka wafer (a i ʻole substrate) a maloʻo.Ma hope o ka maloʻo ʻana, hoʻoneʻe ʻia ka wafer i ka mīkini lithography.Hāʻawi ʻia ka mālamalama i kahi mask e hoʻolālā i ke kumu ma ka mask ma luna o ka photoresist ma ka ʻili wafer, e hiki ai ke ʻike a hoʻoulu i ka hopena photochemical.Hoʻomoʻa ʻia nā wafers i hōʻike ʻia i ka lua o ka manawa, i kapa ʻia ʻo ka post-exposure baking, kahi i piha ai ka hopena photochemical.ʻO ka hope loa, hoʻopā ʻia ka mea hoʻomohala ma luna o ka photoresist ma ka ʻili wafer e hoʻomohala i ke ʻano i ʻike ʻia.Ma hope o ka hoʻomohala ʻana, waiho ʻia ke kumu ma ka mask ma ka photoresist.
ʻO ka gluing, baking, a me ka hoʻomohala ʻana ua hana ʻia i loko o ka screed developer a hana ʻia ka ʻike ma ka photolithograph.Hoʻohana mau ʻia ka mea hoʻomohala screed a me ka mīkini lithography i ka laina, me ka hoʻoili ʻia ʻana o nā wafers ma waena o nā ʻāpana a me ka mīkini me ka hoʻohana ʻana i kahi robot.Ua pani ʻia ka ʻōnaehana hoʻolaha a me ka hoʻomohala holoʻokoʻa a ʻaʻole i ʻike pololei ʻia nā wafers i ke kaiapuni a puni e hōʻemi i ka hopena o nā mea ʻino i ke kaiapuni ma ka photoresist a me nā hopena photochemical.
Doping me nā haumia
Hoʻokomo i nā ion i loko o ka wafer e hana i nā semiconductor ʻano P a me N.
Hoʻāʻo wafer
Ma hope o nā kaʻina hana i luna, hana ʻia kahi lattice o nā dice ma ka wafer.Nānā ʻia nā hiʻohiʻona uila o kēlā me kēia make me ka hoʻohana ʻana i kahi hoʻāʻo pin.
Hoʻopili ʻia
Hoʻopaʻa ʻia nā wafers i hana ʻia, hoʻopaʻa ʻia i nā pine, a hana ʻia i loko o nā pūʻolo like ʻole e like me nā koi, ʻo ia ke kumu e hiki ai ke hoʻopili ʻia ke kumu chip like ma nā ʻano like ʻole.No ka laʻana, DIP, QFP, PLCC, QFN, a pēlā aku.Maʻaneʻi e hoʻoholo nui ʻia e ka hana noiʻi o ka mea hoʻohana, ke kaiapuni noi, ka ʻano mākeke, a me nā mea peripheral ʻē aʻe.
ʻO ka hoʻāʻo ʻana, paʻi
Ma hope o ke kaʻina hana i luna, ua pau ka hana ʻana i ka chip.ʻO kēia kaʻina no ka hoʻāʻo ʻana i ka chip, wehe i nā huahana hemahema a hoʻopaʻa ʻia.
ʻO ka pilina ma waena o nā wafers a me nā chips
Hoʻokumu ʻia kahi chip i ʻoi aku ma mua o hoʻokahi mea semiconductor.ʻO nā semiconductors ka mea maʻamau i nā diodes, triodes, nā paipu hopena kahua, nā mea pale liʻiliʻi, nā inductors, capacitors, a pēlā aku.
ʻO ia ka hoʻohana ʻana i nā ʻano ʻenehana e hoʻololi i ka neʻe ʻana o nā electrons manuahi i loko o ka nucleus atomic i loko o ka pūnāwai pōʻai e hoʻololi i nā waiwai kino o ka nucleus atomic e hana i kahi hoʻopiʻi maikaʻi a maikaʻi ʻole paha o ka nui (electrons) a i ʻole ka liʻiliʻi (puka) hana i nā semiconductors like ʻole.
Hoʻohana maʻamau ka silikoni a me ka germanium i nā mea semiconductor a ʻo ko lākou mau waiwai a me nā mea i loaʻa maʻalahi i ka nui a me ke kumu kūʻai haʻahaʻa no ka hoʻohana ʻana i kēia mau ʻenehana.
Hana ʻia kahi wafer silika me kahi helu nui o nā mea semiconductor.ʻO ka hana o kahi semiconductor, ʻoiaʻiʻo, e hana i kahi kaapuni e like me ka mea e pono ai a noho i loko o ka wafer silika.