XCVU9P-2FLGB2104I FPGA,VIRTEX ULTRASCALE,FCBGA-2104
ʻIke Huahana
| TYPENo.o nā poloka Logic: | 2586150 |
| Ka helu o nā Macrocells: | 2586150Macrocells |
| ʻOhana FPGA: | ʻO Virtex UltraScale Series |
| Kaila hihia noʻonoʻo: | FCBGA |
| Ka helu o nā pine: | 2104Pina |
| Ka helu o nā māka māmā: | 2 |
| Huina RAM Bits: | 77722Kbit |
| Ka helu o nā I/O: | 778I/O's |
| Hooponopono uaki: | MMCM, PLL |
| ʻO ka ʻuala kumu kumu min: | 922mV |
| ʻO ka nui o ka mana lako kumu: | 979mV |
| I/O Voltage: | 3.3V |
| ʻO ka Max Frequency hana: | 725MHz |
| Laulā Huahana: | ʻO Virtex UltraScale XCVU9P |
| MSL: | - |
Hoʻolauna Huahana
BGA kū noPūʻulu pōlele Q Array.
ʻO ka hoʻomanaʻo i hoʻopili ʻia e ka ʻenehana BGA hiki ke hoʻonui i ka mana hoʻomanaʻo i ʻekolu mau manawa me ka ʻole o ka hoʻololi ʻana i ka nui o ka hoʻomanaʻo, BGA a me TSOP
Ke hoʻohālikelike ʻia me, ʻoi aku ka liʻiliʻi o ka leo, ʻoi aku ka maikaʻi o ka hoʻopau wela a me ka hana uila.Ua hoʻomaikaʻi maikaʻi ʻia ka ʻenehana hōkeo BGA i ka hiki ke mālama i kēlā me kēia ʻīniha square, me ka hoʻohana ʻana i nā huahana hoʻomanaʻo ʻenehana BGA packaging ma lalo o ka mana like, ʻo ka leo he hoʻokahi hapakolu wale nō o ka pahu TSOP;Eia kekahi, me ke kuʻuna
Ke hoʻohālikelike ʻia me ka pā TSOP, ʻoi aku ka wikiwiki a ʻoi aku ka maikaʻi o ka puʻupuʻu BGA.
Me ka hoʻomohala ʻana o ka ʻenehana kaiapuni i hoʻohui ʻia, ʻoi aku ka paʻakikī o nā koi ʻana o nā ʻāpana hoʻohui.ʻO kēia no ka mea pili ka ʻenehana paʻi i ka hana o ka huahana, i ka wā i ʻoi aku ka pinepine o ka IC ma mua o 100MHz, hiki i ke ʻano hana hoʻopili kuʻuna ke hana i ka mea i kapa ʻia ʻo "Cross Talk• phenomena, a i ka nui o nā pine o ka IC. ʻoi aku ka nui ma mua o 208 Pin, ʻoi aku ka paʻakikī o ke ʻano o ka hoʻopili kuʻuna. No laila, ma waho aʻe o ka hoʻohana ʻana i ka pahu QFP, ʻo ka hapa nui o nā pahu helu pin kiʻekiʻe o kēia lā (e like me nā pahu kiʻi kiʻi a me nā chipsets, etc.) ua hoʻololi ʻia i BGA (Ball Grid Array. ʻenehana PackQ) I ka wā i ʻike ʻia ai ʻo BGA, ua lilo ia i koho maikaʻi loa no nā pūʻolo kiʻekiʻe kiʻekiʻe, hana kiʻekiʻe, multi-pin e like me ka cpus a me nā pahu alahaka hema / ʻĀkau ma nā motherboards.
Hiki ke hoʻokaʻawale ʻia ka ʻenehana hoʻopihapiha BGA i ʻelima mau ʻāpana:
1.PBGA (Plasric BGA) substrate: ʻO ka maʻamau he 2-4 mau ʻāpana o nā mea olaola i haku ʻia me ka papa multi-layer.CPU moʻo Intel, Pentium 1l
Hoʻopili ʻia nā mea hana Chuan IV i kēia ʻano.
2.CBGA (CeramicBCA) substrate: ʻo ia hoʻi, ka mea hoʻoheheʻe seramika, ʻo ka pilina uila ma waena o ka chip a me ka substrate he flip-chip maʻamau.
Pehea e hoʻouka ai i ka FlipChip (FC no ka pōkole).Hoʻohana ʻia nā mea hana Intel series cpus, Pentium l, ll Pentium Pro
He ʻano hoʻopili.
3.FCBGA(FilpChipBGA) pāpaʻi: Paʻa paʻa paʻa-nui.
4.TBGA (TapeBGA) pani: ʻO ka mea pani he lipine palupalu 1-2 papa PCB papa kaapuni.
5.CDPBGA (Carty Down PBGA) substrate: e pili ana i ka haʻahaʻa pāhaʻi ʻāpana ʻāpana (ʻike pū ʻia ʻo ka lua) i waenakonu o ka pūʻolo.
Loaʻa i ka pūʻolo BGA nā hiʻohiʻona aʻe:
1).10 Hoʻonui ʻia ka helu o nā pine, akā ʻoi aku ka mamao ma waena o nā pine ma mua o ka pahu QFP, kahi e hoʻomaikaʻi ai i ka hua.
2 ).ʻOiai ua hoʻonui ʻia ka mana o ka BGA, hiki ke hoʻomaikaʻi ʻia ka hana hoʻomehana uila ma muli o ke ʻano o ka hoʻoheheʻe ʻia ʻana.
3).He liʻiliʻi ka lohi o ka hoʻouna ʻana i ka hōʻailona, a ua hoʻomaikaʻi maikaʻi ʻia ke alapine adaptive.
4).Hiki i ka hui ke coplanar welding, kahi e hoʻomaikaʻi nui ai i ka hilinaʻi.
