XCZU19EG-2FFVC1760E 100% hou a me ka mea hoʻololi DC i ka DC a me ka hoʻololi ʻana i ka mea hoʻoponopono Chip

wehewehe pōkole:

Hoʻohui kēia ʻohana o nā huahana i kahi hiʻohiʻona waiwai nui 64-bit quad-core a i ʻole ʻelua-core Arm® Cortex®-A53 a me ka ʻōnaehana hoʻoponopono hoʻokumu ʻelua-core Arm Cortex-R5F (PS) a me ka logic programmable (PL) UltraScale architecture i hoʻokahi. mea hana.Hoʻokomo pū ʻia ka hoʻomanaʻo ma-chip, multiport external memory interfaces, a me kahi hoʻonohonoho waiwai o nā pilina pili pili.

E hoʻouna i ka leka uila iā mākou Hoʻoiho i ka Pepa Lā

Huahana Huahana

Huahana Huahana	Waiwai Hiʻona
Mea hana:	Xilinx
Māhele Huahana:	SoC FPGA
Kaohi ʻana o ka moku:	Pono paha kēia huahana i nā palapala hou e hoʻokuʻu aku mai ʻAmelika Hui Pū ʻIa.
RoHS:	Nā kikoʻī
Kāila kau ʻana:	SMD/SMT
Pūʻolo / hihia:	FBGA-1760
kumu:	ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2
Ka helu o nā Core:	7 Core
ʻO ke alapine o ka uaki kiʻekiʻe:	600 MHz, 667 MHz, 1.5 GHz
L1 Cache Instruction Memory:	2 x 32 kB, 4 x 32 kB
L1 Cache Data Memory:	2 x 32 kB, 4 x 32 kB
Ka nui memo o ka papahana:	-
Nui ʻikepili RAM:	-
Ka helu o nā Elements Logic:	1143450 LE
Nā Module Logic Adaptive - ALM:	65340 ALM
Hoʻomanaʻo i hoʻokomo ʻia:	34.6 Mbit
Voltage lako hana:	850 mV
Mahana hana liʻiliʻi loa:	0 C
ʻO ka wela hoʻohana kiʻekiʻe loa:	+ 100 C
Brand:	Xilinx
Hoʻolaha ʻia ka RAM:	9.8 Mbit
Pākaʻi RAM - EBR:	34.6 Mbit
ʻAi ʻoluʻolu:	ʻAe
Ka helu o nā poloka Lahui Logic - LABs:	65340 LAB
Ka helu o nā mea lawe uila:	72 Lawelawe
ʻAno Huahana:	SoC FPGA
moʻo:	XCZU19EG
Ka nui o ka waihona hale hana:	1
Māhele ʻāpana:	SOC - Nā Pūnaehana ma kahi Chip
inoa kalepa:	Zynq UltraScale+

ʻAno Kaapuni Hoʻohui

Ke hoʻohālikelike ʻia me nā electrons, ʻaʻohe nui o nā kiʻi paʻi paʻa, ka launa pū ʻana nāwaliwali, ka ikaika anti-interference ikaika, a ʻoi aku ka maikaʻi no ka lawe ʻana i ka ʻike.Manaʻo ʻia ʻo Optical interconnection e lilo i ʻenehana koʻikoʻi e wāwahi i ka pā hoʻohana mana, ka paia mālama a me ka pā kamaʻilio.Hoʻohui ʻia nā mea hoʻomālamalama, coupler, modulator, waveguide i nā hiʻohiʻona optical density kiʻekiʻe e like me ka photoelectric integrated micro system, hiki ke hoʻomaopopo i ka maikaʻi, ka nui, ka hoʻohana ʻana i ka mana o ka hoʻohui photoelectric kiʻekiʻe, photoelectric integration platform me III - V compound semiconductor monolithic integrated (INP). ) kahua hoʻohui passive, silicate a i ʻole aniani (planar optical waveguide, PLC) platform a me ke kahua silicon-based.

Hoʻohana nui ʻia ka InP platform no ka hana ʻana i ka laser, modulator, detector a me nā mea hana ʻē aʻe, haʻahaʻa ʻenehana haʻahaʻa, kiʻekiʻe ke kumu kūʻai substrate;Ke hoʻohana nei i ka PLC platform e hana i nā ʻāpana passive, haʻahaʻa haʻahaʻa, leo nui;ʻO ka pilikia nui loa me nā paepae ʻelua, ʻaʻole kūpono nā mea me ka uila uila.ʻO ka pōmaikaʻi koʻikoʻi o ka hoʻohui kiʻi kiʻi kiʻi kiʻekiʻe, ʻo ia ke kūpono o ke kaʻina hana me ke kaʻina CMOS a ua haʻahaʻa ke kumukūʻai hana, no laila ua manaʻo ʻia ʻo ia ka optoelectronic hiki loa a hiki i nā mea āpau-optical integration scheme.

ʻElua mau ala hoʻohui no nā mea kiʻi kiʻi kiʻi kiʻekiʻe a me nā kaapuni CMOS.

ʻO ka pōmaikaʻi o ka mua, ʻo ia ka hiki ke hoʻokaʻawale ʻia nā mea photonic a me nā mea uila, akā paʻakikī ka paʻi hope a ua kaupalena ʻia nā noi pāʻoihana.He paʻakikī ka mea hope i ka hoʻolālā ʻana a me ka hana ʻana i ka hoʻohui ʻana o nā mea ʻelua.I kēia manawa, ʻo ka hui hybrid e pili ana i ka hoʻohui ʻana i ka nuklea ka koho maikaʻi loa

Mua: XCKU060-2FFVA1156I 100% hou a me ka mea hoʻololi DC i ka DC a me ka hoʻololi ʻana i ka mea hoʻoponopono Chip

Aʻe: 10AX066H3F34E2SG 100% Hou & Mea Hoʻokiʻekiʻe Kūʻokoʻa Kumu 1 Kaapuni ʻokoʻa 8-SOP

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