10AX066H3F34E2SG 100% Hou & Mea Hoʻokiʻekiʻe Kūʻokoʻa Kumu 1 Kaapuni ʻokoʻa 8-SOP
Huahana Huahana
| EU RoHS | Hoʻokō |
| ECCN (US) | 3A001.a.7.b |
| Kūlana Māhele | ʻeleu |
| HTS | 8542.39.00.01 |
| Kaʻa kaʻa | No |
| PPAP | No |
| Inoa ʻohana | Arria® 10 GX |
| ʻenehana hana | 20nm |
| Mea hoʻohana I/Os | 492 |
| Ka helu o na kakau inoa | 1002160 |
| Ka Voltage Hoʻolako Hana (V) | 0.9 |
| ʻElemu Loko | 660000 |
| Ka helu o na mea hoonui | 3356 (18x19) |
| ʻAno hoʻomanaʻo papahana | SRAM |
| Hoʻomanaʻo i hoʻokomo ʻia (Kbit) | 42660 |
| Huina huina o ka poloka RAM | 2133 |
| Nā Unite Logic Device | 660000 |
| Helu lako o nā DLL/PLL | 16 |
| Nā Kanika Transceiver | 24 |
| Ka wikiwiki o ka lawe ʻana (Gbps) | 17.4 |
| DSP hoʻolaʻa | 1678 |
| PCIe | 2 |
| Hiki i ka polokalamu | ʻAe |
| Kākoʻo Reprogrammability | ʻAe |
| Palekana kope | ʻAe |
| Hiki i loko o ka Pūnaewele | ʻAe |
| Papa māmā | 3 |
| Nā Kūlana I/O Hoʻokahi-Hoʻopau | LVTTL|LVCMOS |
| Pānaʻi hoʻomanaʻo waho | DDR3 SDRAM|DDR4|LPDDR3|RLDRAM II|RLDRAM III|QDRII+SRAM |
| ʻO ka ʻuala hoʻolako hana liʻiliʻi loa (V) | 0.87 |
| ʻO ka Voltage Hoʻohana Nui (V) | 0.93 |
| Voltage I/O (V) | 1.2|1.25|1.35|1.5|1.8|2.5|3 |
| Mahana hana liʻiliʻi loa (°C) | 0 |
| ʻO ka wela hoʻohana kiʻekiʻe loa (°C) | 100 |
| Papa Mahana Mea Hoʻolako | Hoʻonui ʻia |
| inoa kalepa | ʻO Arria |
| Ke kau ʻana | Mauna ʻili |
| Kiʻekiʻe pūʻolo | 2.63 |
| Laulā Pūʻolo | 35 |
| Ka lōʻihi o ka pūʻolo | 35 |
| Ua loli ka PCB | 1152 |
| Inoa Pūʻolo maʻamau | BGA |
| Pūʻolo Mea Hoʻolako | FC-FBGA |
| Helu Pin | 1152 |
| ʻAno alakaʻi | kinipopo |
ʻAno Kaapuni Hoʻohui
Ke hoʻohālikelike ʻia me nā electrons, ʻaʻohe nui o nā kiʻi paʻi paʻa, ka launa pū ʻana nāwaliwali, ka ikaika anti-interference ikaika, a ʻoi aku ka maikaʻi no ka lawe ʻana i ka ʻike.Manaʻo ʻia ʻo Optical interconnection e lilo i ʻenehana koʻikoʻi e wāwahi i ka pā hoʻohana mana, ka paia mālama a me ka pā kamaʻilio.Hoʻohui ʻia nā mea hoʻomālamalama, coupler, modulator, waveguide i nā hiʻohiʻona optical density kiʻekiʻe e like me ka photoelectric integrated micro system, hiki ke hoʻomaopopo i ka maikaʻi, ka nui, ka hoʻohana ʻana i ka mana o ka hoʻohui photoelectric kiʻekiʻe, photoelectric integration platform me III - V compound semiconductor monolithic integrated (INP). ) kahua hoʻohui passive, silicate a i ʻole aniani (planar optical waveguide, PLC) platform a me ke kahua silicon-based.
Hoʻohana nui ʻia ka InP platform no ka hana ʻana i ka laser, modulator, detector a me nā mea hana ʻē aʻe, haʻahaʻa ʻenehana haʻahaʻa, kiʻekiʻe ke kumu kūʻai substrate;Ke hoʻohana nei i ka PLC platform e hana i nā ʻāpana passive, haʻahaʻa haʻahaʻa, leo nui;ʻO ka pilikia nui loa me nā paepae ʻelua, ʻaʻole kūpono nā mea me ka uila uila.ʻO ka pōmaikaʻi koʻikoʻi o ka hoʻohui kiʻi kiʻi kiʻi kiʻekiʻe, ʻo ia ke kūpono o ke kaʻina hana me ke kaʻina CMOS a ua haʻahaʻa ke kumukūʻai hana, no laila ua manaʻo ʻia ʻo ia ka optoelectronic hiki loa a hiki i nā mea āpau-optical integration scheme.
ʻElua mau ala hoʻohui no nā mea kiʻi kiʻi kiʻi kiʻekiʻe a me nā kaapuni CMOS.
ʻO ka pōmaikaʻi o ka mua, ʻo ia ka hiki ke hoʻokaʻawale ʻia nā mea photonic a me nā mea uila, akā paʻakikī ka paʻi hope a ua kaupalena ʻia nā noi pāʻoihana.He paʻakikī ka mea hope i ka hoʻolālā ʻana a me ka hana ʻana i ka hoʻohui ʻana o nā mea ʻelua.I kēia manawa, ʻo ka hui hybrid e pili ana i ka hoʻohui ʻana i ka nuklea ka koho maikaʻi loa












