Kākoʻo ic chip uila ka lawelawe ʻo BOM Service TPS54560BDDAR nā ʻāpana uila uila hou
Huahana Huahana
| ANO | HOIKE |
| Māhele | Nā Kaapuni Hoʻohui (IC) |
| ʻO Mfr | Nā mea kani ʻo Texas |
| moʻo | Eco-Mode™ |
| Pūʻolo | Lepe & Reel (TR) ʻOki lipine (CT) Digi-Reel® |
| SPQ | 2500T&R |
| Kūlana Huahana | ʻeleu |
| Hana | Haʻahaʻa-Iho |
| Hoʻonohonoho hoʻopuka | maikaʻi |
| Topology | Buck, Kaʻa Māhele |
| ʻAno Hoʻopuka | Hiki ke hoʻololi |
| Ka helu o nā mea hoʻopuka | 1 |
| Voltage - Hookomo (Min) | 4.5V |
| Voltage - Hookomo (Max) | 60V |
| Voltage - Hoʻopuka (Min/Paʻa) | 0.8V |
| Voltage - Puke (Max) | 58.8V |
| ʻO kēia manawa - Huakaʻi | 5A |
| Ka pinepine - Ke hoʻololi | 500kHz |
| Hoʻoponopono hoʻoponopono | No |
| Ka Mahana Hana | -40°C ~ 150°C (TJ) |
| ʻAno kau ʻana | Mauna ʻili |
| Pūʻolo / hihia | 8-PowerSOIC (0.154", 3.90mm Laulā) |
| Pūʻolo Mea Mea Hoʻolako | 8-SO PowerPad |
| Helu Huahana Kumu | TPS54560 |
1.ʻO ka inoa IC, ka ʻike ākea a me nā lula inoa:
Kaulana wela.
C=0°C a hiki i 60°C (ka helu kalepa);I=-20°C a hiki i 85°C (papa hana);E=-40°C a hiki i 85°C (ka papa hana hoonui);A=-40°C a hiki i 82°C (aerospace grade);M=-55°C a hiki i 125°C (papa koa)
ʻAno pūʻolo.
A-SSOP;B-CERQUAD;C-TO-200, TQFP;D-Ceramic keleawe luna;E-QSOP;F-Ceramic SOP;H- SBGAJ-Ceramic DIP;K-TO-3;L-LCC, M-MQFP;N-Narrow DIP;N-DIP;Q PLCC;R - Narrow Ceramic DIP (300mil);S - TO-52, T - TO5, TO-99, TO-100;U - TSSOP, uMAX, SOT;W - Ke kumu liʻiliʻi liʻiliʻi ākea (300mil) W-Wide kumu liʻiliʻi liʻiliʻi (300 mil);X-SC-60 (3P, 5P, 6P);Y-Pono keleawe haiki;Z-TO-92, MQUAD;D-Make;/PR-I hoʻoikaika ʻia ka plastic;/W-Wafer.
Ka helu o nā pine:
a-8;b-10;c-12, 192;d-14;e-16;f-22, 256;g-4;h-4;i -4;H-4;I-28;J-2;K-5, 68;L-40;M-6, 48;N 18;O-42;P-20;Q-2, 100;R-3, 843;S-4, 80;T-6, 160;U-60 -6,160;U-60;V-8 (puni);W-10 (puni);X-36;Y-8 (puni);Z-10 (puni).(puni).
'Ōlelo Aʻo: ʻO ka leka mua o ka suffix ʻehā o ka papa interface ʻo E, ʻo ia hoʻi he hana antistatic ka mea.
2.Ka hoʻomohala ʻana i ka ʻenehana paʻi
Ua hoʻohana nā kaʻapuni hoʻohui mua i nā pūʻolo ceramic flat, i hoʻomau ʻia e ka pūʻali koa no nā makahiki he nui ma muli o ko lākou hilinaʻi a me ka liʻiliʻi.Ua hoʻololi koke ʻia ka pōʻai kaapuni kalepa i nā pūʻolo laina ʻelua, e hoʻomaka ana me ka ceramic a laila plastic, a i ka makahiki 1980 ua ʻoi aku ka helu pine o nā kaʻa kaʻa VLSI ma mua o nā palena noi o nā pūʻolo DIP, a hiki i ka puka ʻana mai o nā pin grid arrays a me nā mea lawe chip.
Ua puka mai ka pūʻolo mauna ʻili i nā makahiki 1980 mua a ua kaulana i ka hapa hope o ia ʻumi makahiki.Hoʻohana ʻo ia i kahi pitch pin ʻoi aku ka maikaʻi a he ʻēheu gull a i ʻole J-like pin.ʻO ka Small-Outline Integrated Circuit (SOIC), no ka laʻana, he 30-50% ka liʻiliʻi a he 70% ka liʻiliʻi ma mua o ka DIP like.Loaʻa i kēia pūʻolo nā pine ʻēheu gull e puka mai ana mai nā ʻaoʻao lōʻihi ʻelua a me kahi pine pitch o 0.05".
ʻO ka Small-Outline Integrated Circuit (SOIC) a me nā pūʻolo PLCC.i nā makahiki 1990, ʻoiai ua hoʻohana pinepine ʻia ka pūʻolo PGA no nā microprocessors kiʻekiʻe.ua lilo ka PQFP a me ka ʻāpana kikoʻī liʻiliʻi liʻiliʻi (TSOP) i pūʻolo maʻamau no nā mea helu pine kiʻekiʻe.Ua neʻe nā microprocessors kiʻekiʻe o Intel a me AMD mai nā pūʻolo PGA (Pine Grid Array) i nā pūʻolo Land Grid Array (LGA).
Ua hoʻomaka ka ʻike ʻia ʻana o nā pūʻolo Ball Grid Array i ka makahiki 1970, a i ka makahiki 1990 ua hoʻomohala ʻia ka pūʻolo FCBGA me kahi helu pine kiʻekiʻe ma mua o nā pūʻolo ʻē aʻe.I loko o ka pūʻolo FCBGA, ua hoʻohuli ʻia ka make i luna a i lalo a hoʻopili ʻia i nā pōpō solder ma luna o ka pūʻolo e ka PCB-like base layer ma mua o nā uea.Ma ka mākeke o kēia lā, he ʻāpana kaʻawale hoʻi ka ʻeke i kēia manawa o ke kaʻina hana, a hiki i ka ʻenehana o ka ʻeke ke hoʻopili i ka maikaʻi a me ka hua o ka huahana.
