EP2AGX65DF25C6G hou&kumu ic chips integrated circuits electronic parts kumu kūʻai maikaʻi loa kahi kūʻai aku i ka lawelawe BOM

Huahana Huahana

ʻO Shanghai Fudan Research Report: FPGA alakaʻi e hoʻomau i ka ulu kiʻekiʻe, alakaʻi ʻenehana + hoʻohui kūʻai

1. Shanghai Fudan: ʻO ka hui hoʻolālā IC alakaʻi o Kina me ka ulu wikiwiki o nā FPGA

Hoʻokumu ʻia ma 1998, ʻo Shanghai Fudan kahi mea hana nui ma Kina e kālele ana i ka hoʻolālā chip digital a me ka hoʻāʻo ʻana i ka chip.I ka makahiki 1998, ua hoʻomaka ka hui i kāna ʻoihana i nā kaapuni kūikawā no nā kelepona, nā mīkini hoʻoheheʻe uila uila, a me nā kaʻa, a i ka makahiki 1999, ua hoʻokuʻu ʻo ia i nā pahu kāleka hoʻomanaʻo 8K a ua hoʻopaʻa inoa ʻia ma ka Hong Kong GEM Board ma 2000. I nā makahiki ʻelima ma hope. ʻO ka papa inoa kūleʻa ma Hong Kong, ua hoʻomaka ka hui i nā ʻāpana kāleka akamai, nā MCU mika ikehu, nā ʻāpana RFID, a me nā ʻāpana SoC kelepona paʻa, e komo kūleʻa ana i ka mākeke kālā, kaʻa, a me nā mea kūʻai uila;ua hoʻokuʻu ka hui i nā kīʻaha mana NFC no ke kāleka kaʻa lehulehu ma 2015. Ma 2017, ua loaʻa i kā mākou SLC NAND Flash a me NOR Flash nā huahana i kahi holomua pālua i ka R&D a me nā kūʻai nui.I ka makahiki 2020, ua hoʻokumu ka hui i ka chip 28nm PSoC mua o Kina.I ka nalu o ka wā e hiki mai ana o ka hoʻololi ʻana i nā pahu FPGA, ua manaʻo ʻia ʻo Shanghai Fudan ke alakaʻi ma Kina.

He mea koʻikoʻi ka ʻaoʻao o Fudan, a ʻo ka hoʻoikaika kaulike e hōʻoia i ka paʻa lōʻihi o nā limahana ʻenehana koʻikoʻi.ʻO Shanghai Fudan ka luna hoʻomalu o ka papa, hope peresidena, poʻokela ʻenekinia, a me hope poʻokela ʻenekinia ua hana nā mea a pau ma ke Kulanui ʻo Fudan, a ua hana pū ka luna huahana a me ka luna hoʻomalu palekana ma Shanghai Fudan no ka manawa lōʻihi.No laila, ʻo ka hoʻokele koʻikoʻi o Shanghai Fudan he kumu ikaika i ke Kulanui ʻo Fudan.Loaʻa i nā lālā o ka hui ka ʻike ʻoihana waiwai, ka pae hoʻokele maikaʻi loa, a me kahi pae ʻenehana hohonu.

He kuleana koʻikoʻi ko Shanghai Fudan a ua kākoʻo ʻia e ka Shanghai State-owned Assets Supervision and Administration Commission a me Fudan University.Ma Iune 30, 2022, ʻo Shanghai Fudan Fudan Science and Technology Industry Holding Company Limited ka mea kuleana nui loa, ʻo ia ka 70.2% nona ka Shanghai SASAC, a ʻo ka lua o ka mea kuleana nui loa ma Shanghai Fudan High Technology Company, ʻo ia ka 100% nona ka. Kulanui ʻo Fudan.Ua hoʻokumu ka moku'āina paʻa a ikaika i ke kumu no ka hoʻomohala ʻana o ka ʻoihana ma ke kahua hoʻolālā IC me nā pale ʻenehana kiʻekiʻe.Hoʻonui ka paepae waiwai o nā limahana i ke kūpaʻa lōʻihi o ka hoʻokele a me nā hui ʻenehana.Wahi a ka hoʻolaha ʻana o ka hui, paʻa nā luna o ka hui i kēia manawa he 27.207 miliona mau ʻāpana, ʻo ia ka 3.34% o ka huina kālā o ka hui.He 4 mau papa hana kuleana o ka Hui, ʻo ia hoʻi ʻo Shanghai Shengteng, Shanghai Yutang, Shanghai Xuling, a me Shanghai Trench, me 150 mau limahana e komo ana i ka ʻāpana, helu no 9.8% o ka huina o nā limahana o ka Hui, e paʻa ana i ka huina o 35.172 miliona. mahele, helu no 4.32% o ka huina puu dala o ka Hui.

He 5 mau ʻoihana nui ka hui a me 4 laina huahana nui.ʻEhā laina huahana o ka hui: palekana a me nā ʻāpana ʻike, ka hoʻomanaʻo ʻole-volatile, nā mīkini mika akamai, a me nā ʻāpana programmable gate arrays (FPGAs).Ua kūkulu ka hui i kahi pilina pili lōʻihi a paʻa me nā mea hana i luna a i lalo i ke kaulahao ʻoihana.Ua hoʻolauna maikaʻi ʻia nā huahana o ka hui iā Samsung, LG, VIVO, Haier, Hisense, Lenovo, a me nā mea hana kaulana ʻē aʻe ma waho o Kina, a ʻo kāna mau huahana hilinaʻi nui e like me FPGA ua ʻike nui ʻia e nā mea kūʻai.

E hoʻonui mau ka loaʻa kālā o ka hui mai RMB 1.424 biliona a i RMB 2.577 biliona ma 2018-2021, a ʻo ka loaʻa kālā he RMB 105 miliona, RMB 163 miliona, RMB 133 miliona, a me RMB 514 miliona mai 2018-2021, kēlā me kēia.I ka makahiki 2019, ua hoʻonui ʻia ka hoʻokūkū ma ka mākeke semiconductor i ka emi ʻana o nā kumukūʻai o nā huahana o ka ʻoihana, ʻoi aku ka nui o nā huahana mālama, a me ka emi ʻana o nā palena nui i hui pū ʻia me ka hoʻopukapuka kiʻekiʻe i ka noiʻi a me ka hoʻomohala ʻana i alakaʻi i kahi poho.Wahi a ka hoʻolaha ʻana o ka hui, e hoʻomaka ana mai ka hoʻomaka ʻana o 28nm billion gate FPGA chips ma 2018, ʻoi aku ka nui o ka hoʻouna ʻana o ka chip FPGA pili i ka makahiki ma mua o 60 miliona.Me ka ulu ʻana o ka ʻoihana a me ka koi ikaika i ka makahiki 2021, kūʻai maikaʻi ʻia nā laina huahana nui ʻehā o ka ʻoihana, me ka ulu ʻana o ka loaʻa kālā he 52% i kēlā me kēia makahiki.

ʻO ka loaʻa kālā FPGA a me ka mīkini mika MCU no ka hoʻonui ʻana i ka hui huahana.Wahi a ka hoʻolaha ʻana o ka hui, i ka makahiki 2021, ʻo ka FPGA chip a me ka mīkini akamai MCU chip loaʻa ka 427 miliona yuan a me 295 miliona yuan i kēlā me kēia, e helu ana no ka 12% a me 17% o ka huina kālā o ka hui, kahi hoʻonui o 4 mau pakeneka. 6 pākēneka helu mai 2018. Ua hoʻomohala ikaika ka Hui i nā huahana chip FPGA, a ke hoʻomau nei ka piʻi ʻana o ka loaʻa kālā.

Hoʻomaikaʻi nui ʻia ka loaʻa kālā, a hāʻawi nā chips FPGA i ka loaʻa kālā nui.Wahi a ka hoʻolaha ʻana o ka hui, ʻo ka emi ʻana o ka nui o ka loaʻa kālā ma 2019 ma muli o ka emi ʻana o ka nui o ka loaʻa kālā o ka palekana a me nā ʻāpana ʻike a me nā huahana hoʻomanaʻo non-volatile. i ka poho o ka waiwai ma ka makahiki.I ka makahiki 2021, ua hōʻea ka huina kālā i ka 58.91%, kahi hoʻonui o kahi kokoke i 13 mau helu makahiki-ma-makahiki.Hōʻike nā hualoaʻa hou loa o ka hui 2022H1 ua piʻi aʻe ka huina kālā i 65.00%.Ma ka huahana, ʻo FPGA a me nā ʻāpana pili i loaʻa ka palena kiʻekiʻe kiʻekiʻe loa, me kahi pae kumu kūʻai paʻa ma luna o 80% i nā makahiki ʻelua i hala.Ke hoʻopōmaikaʻi ʻia mai ka boom kiʻekiʻe o ka ʻoihana semiconductor, e hoʻonui ʻia nā palena nui o nā laina huahana ʻekolu o ka ʻoihana e 10 a 20 mau helu ma 2021 i hoʻohālikelike ʻia me 2020.