Huahana Huahana

Hōʻike ʻo Intel i nā kikoʻī chip 3D: hiki ke hoʻopaʻa i 100 billion transistors, hoʻolālā e hoʻomaka i 2023

ʻO ka 3D stacked chip ke kuhikuhi hou a Intel e hoʻokūkū i ke kānāwai o Moore ma ka hoʻopaʻa ʻana i nā ʻāpana logic i ka chip e hoʻonui nui i ka nui o nā CPU, GPU, a me nā mea hana AI.Me nā kaʻina hana chip kokoke i kahi kū, ʻo ia wale nō ke ala e hoʻomau ai i ka hoʻomaikaʻi ʻana i ka hana.

I kēia mau lā, ua hōʻike ʻo Intel i nā kikoʻī hou o kāna hoʻolālā chip 3D Foveros no ka Meteor Lake e hiki mai ana, Arrow Lake, a me Lunar Lake chips ma ka hui semiconductor ʻoihana ʻo Hot Chips 34.

Ua ʻōlelo ʻia nā lono hou e hoʻopaneʻe ʻia ʻo Intel's Meteor Lake ma muli o ka pono e hoʻololi i ka Intel GPU tile / chipset mai ka TSMC 3nm node i ka 5nm node.ʻOiai ʻaʻole i kaʻana like ʻo Intel i ka ʻike e pili ana i ka node kikoʻī e hoʻohana ai ia no ka GPU, ua ʻōlelo kekahi ʻelele hui ʻaʻole i loli ka node i hoʻolālā ʻia no ka ʻāpana GPU a aia ke kaʻina hana no ka hoʻokuʻu ʻana i ka manawa ma 2023.

ʻO ka mea nui, i kēia manawa e hana wale ʻo Intel i hoʻokahi o nā ʻāpana ʻehā (ʻo ka ʻāpana CPU) i hoʻohana ʻia e kūkulu i kāna mau pahu Meteor Lake - TSMC e hana i nā ʻekolu ʻē aʻe.Hōʻike nā kumu ʻoihana ʻo ka tile GPU ʻo TSMC N5 (kaʻina 5nm).

Ua kaʻana like ʻo Intel i nā kiʻi hou loa o ke kaʻina hana ʻo Meteor Lake, kahi e hoʻohana ai i ka node kaʻina hana 4 o Intel (kaʻina 7nm) a e paʻi mua i ka mākeke ma ke ʻano he polokalamu kelepona me ʻeono cores nui a me ʻelua cores liʻiliʻi.Hoʻopili ka Meteor Lake a me Arrow Lake i nā pono o nā mākeke PC kelepona a me ka papa, aʻo Lunar Lake e hoʻohana ʻia i nā puke kikoʻī a māmā, e uhi ana i ka mākeke 15W a ma lalo.

Ke hoʻololi wikiwiki nei nā holomua i ka ʻeke a me nā interconnects i ka helehelena o nā mea hana hou.He mea koʻikoʻi nā mea ʻelua e like me ke kaʻina hana node ʻenehana - a ʻoi aku ka mea nui i kekahi mau ʻano.

ʻO ka nui o nā hōʻike a Intel i ka Pōʻakahi e pili ana i kāna ʻenehana 3D Foveros packaging, e hoʻohana ʻia i kumu no kāna Meteor Lake, Arrow Lake, a me Lunar Lake kaʻina hana no ka mākeke kūʻai.Hāʻawi kēia ʻenehana iā Intel e hoʻopaʻa pololei i nā ʻāpana liʻiliʻi ma luna o kahi puʻupuʻu kumu i hui pū ʻia me nā hui Foveros.Ke hoʻohana nei ʻo Intel iā Foveros no kāna Ponte Vecchio a me Rialto Bridge GPUs a me Agilex FPGAs, no laila hiki ke noʻonoʻo ʻia ʻo ia ka ʻenehana kumu no nā huahana o ka hanauna e hiki mai ana.

Ua lawe mua mai ʻo Intel i ka 3D Foveros e kūʻai aku i kāna mau mea hana Lakefield haʻahaʻa, akā ʻo ka 4-tile Meteor Lake a kokoke i 50-tile Ponte Vecchio nā pahu mua o ka hui e hana nui ʻia me ka ʻenehana.Ma hope o Arrow Lake, e hoʻololi ʻo Intel i ka UCI interconnect hou, e ʻae iā ia e komo i ka kaiaola chipset me ka hoʻohana ʻana i kahi interface maʻamau.

Ua hōʻike ʻo Intel e kau ʻo ia i ʻehā Meteor Lake chipsets (i kapa ʻia ʻo "tiles / tiles" ma ka ʻōlelo a Intel) ma luna o ka passive Foveros intermediate layer / base tile.ʻOkoʻa ka tile kumu ma Meteor Lake mai ka mea ma Lakefield, hiki ke manaʻo ʻia he SoC ma ke ʻano.Kākoʻo pū ʻia ka ʻenehana hōkeo 3D Foveros i kahi papa waena hana.Ua ʻōlelo ʻo Intel e hoʻohana ana i kahi kaʻina hana 22FFL haʻahaʻa haʻahaʻa a haʻahaʻa loa (e like me Lakefield) e hana i ka papa interposer Foveros.Hāʻawi pū ʻo Intel i kahi ʻano hou 'Intel 16' o kēia node no kāna mau lawelawe hoʻokumu, akā ʻaʻole maopopo i ka mana o ka Meteor Lake base tile e hoʻohana ai ʻo Intel.

E hoʻokomo ʻo Intel i nā modules compute, nā poloka I/O, nā poloka SoC, a me nā poloka kiʻi (GPU) me ka hoʻohana ʻana i nā kaʻina Intel 4 ma kēia papa waena.Hoʻolālā ʻia kēia mau ʻāpana āpau e Intel a hoʻohana i ka hoʻolālā Intel, akā ʻo TSMC e OEM nā poloka I/O, SoC, a me GPU i loko o lākou.ʻO kēia ke kumu e hana wale ʻo Intel i nā poloka CPU a me Foveros.

Lele nā ​​kumu ʻoihana e make ka I/O a me SoC ma ke kaʻina hana N6 o TSMC, ʻoiai ke hoʻohana nei ka tGPU iā TSMC N5.(He mea pono ke hoʻomaopopo ʻia e pili ana ʻo Intel i ka tile I/O ma ke ʻano he 'I/O Expander', a i ʻole IOE)

ʻO nā node e hiki mai ana ma ka palapala alanui Foveros he 25 a me 18-micron pitches.Ua ʻōlelo ʻo Intel he hiki ke hoʻokō i ka spacing bump 1-micron i ka wā e hiki mai ana me ka hoʻohana ʻana i nā Hybrid Bonded Interconnects (HBI).