XC7K325T-1FBG676I 676-FCBGA (27×27) kaapuni hoʻohuihui IC FPGA 400 I/O 676FCBGA mea uila
Huahana Huahana
| ANO | HOIKE |
| Māhele | Nā Kaapuni Hoʻohui (IC)Hoʻokomo ʻiaNā FPGA (Field Programmable Gate Array) |
| ʻO Mfr | AMD Xilinx |
| moʻo | Kintex®-7 |
| Pūʻolo | pā |
| Pūʻolo maʻamau | 1 |
| Kūlana Huahana | ʻeleu |
| Ka helu o nā LAB/CLB | 25475 |
| Ka helu o nā Elements Logic / Cells | 326080 |
| Huina RAM Bits | 16404480 |
| Ka helu o I/O | 400 |
| Voltage - Hoʻolako | 0.97V ~ 1.03V |
| ʻAno kau ʻana | Mauna ʻili |
| Ka Mahana Hana | -40°C ~ 100°C (TJ) |
| Pūʻolo / hihia | 676-BBGA, FCBGA |
| Pūʻolo Mea Mea Hoʻolako | 676-FCBGA (27×27) |
| Helu Huahana Kumu | XC7K325 |
No ke aha i hiki ʻole ai i ke kaʻa kaʻa i ka nele o ke kai kumu e hoʻokau i ka ʻeha?
Mai ka hāʻawi ʻana o ka chip honua i kēia manawa a me ke kūlana koi, paʻakikī ka pilikia o ka pōkole chip i ka wā pōkole, a e hoʻoikaika nui ʻia, a ʻo nā mīkini kaʻa ka mea mua e lawe i ka ʻeha.Hoʻokaʻawale ʻia mai nā mīkini uila mea kūʻai aku, hoʻohana nui ʻia i kēia manawa, ʻoi aku ka kiʻekiʻe o ka paʻakikī o ka hoʻoponopono ʻana, ʻoi aku ka lua i ka papa koa, a ʻo ke ola o nā pahu kaʻa kaʻa pinepine pono e hiki i 15 mau makahiki a ʻoi aku paha, kahi hale hoʻokipa o kahi hui kaʻa i nā chip automotive i koho ʻia. , a ʻaʻole hiki ke hoʻololi maʻalahi.
Mai ka mākeke mākeke, ʻo ka pae honua automotive semiconductor scale ma 2020 ma kahi o $ 46 biliona, e helu ana ma kahi o 12% o ka mākeke semiconductor holoʻokoʻa, ʻoi aku ka liʻiliʻi ma mua o nā kamaʻilio (me nā smartphones), PC, etc. ke manaʻo nei i kahi ulu ulu semiconductor automotive honua ma kahi o 14% ma 2016-2021, e alakaʻi ana i ka ulu ulu ma nā ʻāpana āpau o ka ʻoihana.
Hoʻokaʻawale ʻia ka chip automotive i MCU, IGBT, MOSFET, sensor, a me nā mea semiconductor ʻē aʻe.I nā kaʻa wahie maʻamau, ʻoi aku ka MCU i ka 23% o ka nui o ka waiwai.I nā kaʻa uila maʻemaʻe, ʻo MCU ka 11% o ka waiwai ma hope o IGBT, kahi puʻupuʻu semiconductor mana.
E like me kāu e ʻike ai, ua māhele ʻia nā mea pāʻani nui i ka chip automotive global me i ʻelua mau ʻāpana: nā mea hana chip automotive maʻamau a me nā mea hana chip consumer.Ma kahi nui, e hana nui nā hana a kēia hui o nā mea hana i ka mana hana o nā hui kaʻa hope.Eia nō naʻe, i kēia mau manawa i hala iho nei, ua hoʻopilikia ʻia kēia mau mea hana poʻo e nā hanana like ʻole i hoʻopilikia i ka hoʻolako ʻana i nā chips, synchronously alakaʻi i ke kaulahao o ka hāʻawi ʻana a me ke koi ʻole ʻana ma waena o ke kaulahao ʻoihana.
Ma ka lā 5 o Nowemapa i ka makahiki i hala, ma hope o ka hoʻoholo ʻana a ka hoʻokele STMicroelectronics (ST) ʻaʻole e hāʻawi i ka poʻe limahana i ka piʻi ʻana o ka uku i kēia makahiki, ua hoʻokumu nā uniona ST French nui ʻekolu, CAD, CFDT, a me CGT, i kahi hahau ma nā mea kanu ST French.ʻO ke kumu o ka piʻi ʻole ʻana o ka uku e pili ana i ka New Coronavirus, kahi maʻi maʻi koʻikoʻi ma ʻEulopa i Malaki i kēia makahiki, a i ka pane ʻana i nā hopohopo o nā limahana e pili ana i ka ʻaelike ʻana i ka New Coronavirus, ua loaʻa ʻo ST i kahi ʻaelike me nā mea hana Farani e hōʻemi i ka hana ʻoihana. e 50%.I ka manawa like, ua hoʻonui ʻia nā kumukūʻai no ka pale ʻana a me ka mālama ʻana i ke ahulau.
Eia hou, Infineon, NXP ma muli o ka hopena o ka nalu anuanu o ʻAmelika Hui Pū ʻIa, ʻo ka hale hana chip aia ma Austin, Texas, e hoʻopau i ka pani ʻana;ʻO ka hale hana Renesas Electronics Naka (Hitachi Naka City, Ibaraki Prefecture, Iapana) ke ahi i hoʻopilikia nui i ka wahi i hōʻinoʻia he 12-inch high-end semiconductor wafer production line, ka hana nui o nā microprocessors e hoʻomalu i ka hoʻokele kaʻa.Ua manaʻo ʻia he 100 mau lā no ka hoʻi ʻana o ka chip i nā pae mua o ke ahi.
