DS90UB927QSQXNOPB NA Bom Service Transistor Diode Integrated Circuit Electronics Components
Huahana Huahana
ANO | HOIKE |
Māhele | Nā Kaapuni Hoʻohui (IC) |
ʻO Mfr | Nā mea kani ʻo Texas |
moʻo | Kaʻa, AEC-Q100 |
Pūʻolo | Lepe & Reel (TR) ʻOki lipine (CT) Digi-Reel® |
SPQ | 2500 T&R |
Kūlana Huahana | ʻeleu |
Hana | Mea hoʻolaha |
Ka helu ʻikepili | 2.975Gbps |
ʻAno hoʻokomo | FPD-Lulu, LVDS |
ʻAno Hoʻopuka | FPD-Lulu III, LVDS |
Ka helu o nā mea hoʻokomo | 13 |
Ka helu o nā mea hoʻopuka | 1 |
Voltage - Hoʻolako | 3V ~ 3.6V |
Ka Mahana Hana | -40°C ~ 105°C (TA) |
ʻAno kau ʻana | Mauna ʻili |
Pūʻolo / hihia | 40-WFQFN Papa Hōʻike |
Pūʻolo Mea Mea Hoʻolako | 40-WQFN (6x6) |
Helu Huahana Kumu | DS90UB927 |
1.Nā manaʻo chip
E hoʻomaka kākou ma ka hoʻokaʻawale ʻana i kekahi mau manaʻo kumu: chips, semiconductors, a me nā kaapuni i hoʻohui ʻia.
Semiconductor: he mea me nā waiwai conductive ma waena o ka conductor a me ka insulator ma ka lumi wela.ʻO nā mea semiconductor maʻamau ka silika, germanium, a me gallium arsenide.I kēia mau lā, ʻo ka mea semiconductor maʻamau i hoʻohana ʻia i nā chips he silika.
Kaapuni hoʻohui ʻia: kahi mea uila liʻiliʻi a i ʻole ʻāpana.Ke hoʻohana nei i kekahi kaʻina hana, ua hui pū ʻia nā transistors, resistors, capacitors, a me nā inductors i koi ʻia i kahi kaapuni a me nā wili, i hana ʻia ma kahi liʻiliʻi liʻiliʻi a i ʻole nā wafers semiconductor liʻiliʻi a i ʻole substrates dielectric, a laila hoʻopili ʻia i loko o ka hale paipu e lilo i hale liʻiliʻi me ka hana kaapuni pono.
Chip: ʻO ia ka hana o nā transistors a me nā mea hana ʻē aʻe i koi ʻia no kahi kaapuni ma kahi ʻāpana semiconductor (mai Jeff Dahmer).ʻO nā chips nā mea lawe o nā kaapuni hoʻohui.
Eia nō naʻe, ma kahi ʻano haʻiki, ʻaʻohe ʻokoʻa ma waena o ka IC, chip, a me ke kaapuni hoʻohui a mākou e kuhikuhi ai i kēlā me kēia lā.ʻO ka ʻoihana IC a me ka ʻoihana chip a mākou e kamaʻilio maʻamau e pili ana i ka ʻoihana like.
No ka hōʻuluʻulu ʻana i loko o ka ʻōlelo hoʻokahi, ʻo ka chip kahi huahana kino i loaʻa ma ka hoʻolālā ʻana, hana ʻana, a me ka hoʻopili ʻana i kahi kaapuni i hoʻohui ʻia me ka hoʻohana ʻana i nā semiconductors ma ke ʻano he kumu.
Ke kau ʻia ka chip ma ke kelepona paʻa lima, kamepiula a papa paha, lilo ia i puʻuwai a me ka ʻuhane o ia mau huahana uila.
Pono ka pale paʻi i kahi pahu hoʻopā, kahi pahu hoʻomanaʻo e mālama i ka ʻike, kahi pahu baseband, kahi chip RF, kahi pahu Bluetooth e hoʻokō ai i nā hana kamaʻilio, a me kahi GPU e kiʻi i nā kiʻi maikaʻi loa ...... ʻO nā pahu āpau i loko o kahi kelepona. Hoʻohui ʻia ke kelepona ma mua o 100.
2.Hoʻokaʻawale chip
ʻO ke ala o ka hana ʻana, hiki ke hoʻokaʻawale ʻia nā hōʻailona i nā chips analog, nā chips digital
ʻO nā ʻāpana kikohoʻe nā mea e hana ana i nā hōʻailona kikohoʻe, e like me nā CPUs a me nā kaʻapuni logic, ʻoiai nā chips analog nā mea e hana ana i nā hōʻailona analog, e like me nā mea hoʻonui hana, linear voltage regulators, a me nā kumu uila kuhikuhi.
ʻO ka hapa nui o nā chips o kēia mau lā he kikohoʻe a me ka analog, a ʻaʻohe kūlana paʻa e pili ana i ke ʻano o ka huahana e hoʻokaʻawale ʻia ai ka chip, akā ʻike ʻia ia e ka hana nui o ka chip.
Hiki ke hoʻokaʻawale ʻia kēia mau mea e like me nā hiʻohiʻona noi: nā ʻāpana aerospace, nā ʻāpana kaʻa, nā ʻāpana ʻenehana, nā ʻāpana kalepa.
Hiki ke hoʻohana ʻia nā chips i nā ʻāpana aerospace, automotive, ʻoihana a me nā mea kūʻai aku.ʻO ke kumu o kēia māhele ʻo ia ka loaʻa ʻana o kēia mau ʻāpana i nā koi hana ʻokoʻa no nā chips, e like me ke ʻano wela, ka pololei, ka manawa hana pilikia ʻole (ola), a pēlā aku.
ʻOi aku ka nui o ka wela o nā ʻāpana ʻenehana ma mua o nā ʻāpana ʻoihana, a ʻoi aku ka maikaʻi o ka hana ʻana a ʻoi aku ka pipiʻi o nā chip aerospace-grade.
Hiki ke hoʻokaʻawale ʻia e like me ka hana i hoʻohana ʻia: GPU, CPU, FPGA, DSP, ASIC, a i ʻole SoC ......