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DS90UB927QSQXNOPB NA Bom Service Transistor Diode Integrated Circuit Electronics Components

wehewehe pōkole:


Huahana Huahana

Huahana Huahana

Huahana Huahana

ANO HOIKE
Māhele Nā Kaapuni Hoʻohui (IC)

Ikepili

Nā mea hoʻolaha, Deserializers

ʻO Mfr Nā mea kani ʻo Texas
moʻo Kaʻa, AEC-Q100
Pūʻolo Lepe & Reel (TR)

ʻOki lipine (CT)

Digi-Reel®

SPQ 2500 T&R
Kūlana Huahana ʻeleu
Hana Mea hoʻolaha
Ka helu ʻikepili 2.975Gbps
ʻAno hoʻokomo FPD-Lulu, LVDS
ʻAno Hoʻopuka FPD-Lulu III, LVDS
Ka helu o nā mea hoʻokomo 13
Ka helu o nā mea hoʻopuka 1
Voltage - Hoʻolako 3V ~ 3.6V
Ka Mahana Hana -40°C ~ 105°C (TA)
ʻAno kau ʻana Mauna ʻili
Pūʻolo / hihia 40-WFQFN Papa Hōʻike
Pūʻolo Mea Mea Hoʻolako 40-WQFN (6x6)
Helu Huahana Kumu DS90UB927

 

1.Nā manaʻo chip

E hoʻomaka kākou ma ka hoʻokaʻawale ʻana i kekahi mau manaʻo kumu: chips, semiconductors, a me nā kaapuni i hoʻohui ʻia.

Semiconductor: he mea me nā waiwai conductive ma waena o ka conductor a me ka insulator ma ka lumi wela.ʻO nā mea semiconductor maʻamau ka silika, germanium, a me gallium arsenide.I kēia mau lā, ʻo ka mea semiconductor maʻamau i hoʻohana ʻia i nā chips he silika.

Kaapuni hoʻohui ʻia: kahi mea uila liʻiliʻi a i ʻole ʻāpana.Ke hoʻohana nei i kekahi kaʻina hana, ua hui pū ʻia nā transistors, resistors, capacitors, a me nā inductors i koi ʻia i kahi kaapuni a me nā wili, i hana ʻia ma kahi liʻiliʻi liʻiliʻi a i ʻole nā ​​​​wafers semiconductor liʻiliʻi a i ʻole substrates dielectric, a laila hoʻopili ʻia i loko o ka hale paipu e lilo i hale liʻiliʻi me ka hana kaapuni pono.

Chip: ʻO ia ka hana o nā transistors a me nā mea hana ʻē aʻe i koi ʻia no kahi kaapuni ma kahi ʻāpana semiconductor (mai Jeff Dahmer).ʻO nā chips nā mea lawe o nā kaapuni hoʻohui.

Eia nō naʻe, ma kahi ʻano haʻiki, ʻaʻohe ʻokoʻa ma waena o ka IC, chip, a me ke kaapuni hoʻohui a mākou e kuhikuhi ai i kēlā me kēia lā.ʻO ka ʻoihana IC a me ka ʻoihana chip a mākou e kamaʻilio maʻamau e pili ana i ka ʻoihana like.

No ka hōʻuluʻulu ʻana i loko o ka ʻōlelo hoʻokahi, ʻo ka chip kahi huahana kino i loaʻa ma ka hoʻolālā ʻana, hana ʻana, a me ka hoʻopili ʻana i kahi kaapuni i hoʻohui ʻia me ka hoʻohana ʻana i nā semiconductors ma ke ʻano he kumu.

Ke kau ʻia ka chip ma ke kelepona paʻa lima, kamepiula a papa paha, lilo ia i puʻuwai a me ka ʻuhane o ia mau huahana uila.

Pono ka pale paʻi i kahi pahu hoʻopā, kahi pahu hoʻomanaʻo e mālama i ka ʻike, kahi pahu baseband, kahi chip RF, kahi pahu Bluetooth e hoʻokō ai i nā hana kamaʻilio, a me kahi GPU e kiʻi i nā kiʻi maikaʻi loa ...... ʻO nā pahu āpau i loko o kahi kelepona. Hoʻohui ʻia ke kelepona ma mua o 100.

2.Hoʻokaʻawale chip

ʻO ke ala o ka hana ʻana, hiki ke hoʻokaʻawale ʻia nā hōʻailona i nā chips analog, nā chips digital

ʻO nā ʻāpana kikohoʻe nā mea e hana ana i nā hōʻailona kikohoʻe, e like me nā CPUs a me nā kaʻapuni logic, ʻoiai nā chips analog nā mea e hana ana i nā hōʻailona analog, e like me nā mea hoʻonui hana, linear voltage regulators, a me nā kumu uila kuhikuhi.

ʻO ka hapa nui o nā chips o kēia mau lā he kikohoʻe a me ka analog, a ʻaʻohe kūlana paʻa e pili ana i ke ʻano o ka huahana e hoʻokaʻawale ʻia ai ka chip, akā ʻike ʻia ia e ka hana nui o ka chip.

Hiki ke hoʻokaʻawale ʻia kēia mau mea e like me nā hiʻohiʻona noi: nā ʻāpana aerospace, nā ʻāpana kaʻa, nā ʻāpana ʻenehana, nā ʻāpana kalepa.

Hiki ke hoʻohana ʻia nā chips i nā ʻāpana aerospace, automotive, ʻoihana a me nā mea kūʻai aku.ʻO ke kumu o kēia māhele ʻo ia ka loaʻa ʻana o kēia mau ʻāpana i nā koi hana ʻokoʻa no nā chips, e like me ke ʻano wela, ka pololei, ka manawa hana pilikia ʻole (ola), a pēlā aku.

ʻOi aku ka nui o ka wela o nā ʻāpana ʻenehana ma mua o nā ʻāpana ʻoihana, a ʻoi aku ka maikaʻi o ka hana ʻana a ʻoi aku ka pipiʻi o nā chip aerospace-grade.

Hiki ke hoʻokaʻawale ʻia e like me ka hana i hoʻohana ʻia: GPU, CPU, FPGA, DSP, ASIC, a i ʻole SoC ......


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